GIGABYTE's Ultra Durable 3™ Classic


GIGABYTE started 2009 off with announcing a whole slew of their latest AMD based motherboards would now be equipped with the GIGABYTE Ultra Durable 3™ Classic technology. Until now, GIGABYTE has only paired the Ultra Durable™ technologies on their Intel based lineup. So, what is Ultra Durable 3™ Classic and why is this great news for AMD users?


GIGABYTE Ultra Durable 3™ Classic motherboards feature double the amount of copper in the Power and Ground layers of the PCB. Most traditional motherboard designs utilize a single ounce of copper for each layer, whereas GIGABYTE’s Ultra Durable 3™ Classic motherboards feature 2 ounces per layer.


Benefits of 2 oz Copper Design


Lower Average Temperature

Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. The added copper in the PCB layers acts as an internal heat spreader throughout the entire board, moving the hot air from the power zone to the outlining areas of the motherboard where it can be quickly cooled.
CPU: AMD Phenom X4 9950
Memory : DDR2 800 512MB *2
VGA : Integrated UMA chipset
Testing Environment:
Tool: Thermal Now @ 100% Power; Thermal Solution: Water cooling to avoid air flow for accurate measurement;
Room temp: 25°C

Lower Impedance

In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable 3™ Classic motherboards, this means total PCB electrical waste is reduced by 50%. The byproduct of electrical waste is heat, so this means Ultra Durable 3™ Classic is able to further reduce the amount of heat generated throughout the PCB.
2 ounces of copper also provides improved signal quality which provides better system stability and allows for greater margins for overclocking.
Lower EMI
A good PCB circuit layout is the key of controlling EMI emission. GIGABYTE's Ultra Durable 3™ Classic design features 2 ounces of copper for ground layers which helps to lower EMI emissions by providing a more effective grounding plane.
DDR2 1200+ Memory Support

Delivering native support for DDR2 memory up to 1200+MHz on AMD platform, GIGABYTE Ultra Durable 3™ Classic motherboards allow users to reach higher memory frequencies at lower voltages. This not only allows more margin for overclocking, but it also lets users achieve higher memory performance with lower power consumption to run even the most memory intensive applications such as high-definition video and 3D games with ease.

50,000 Hour Japanese Solid Capacitors

GIGABYTE Ultra Durable 3™ Classic motherboards are equipped with solid capacitors developed by leading Japanese manufacturers. With an average lifespan of 50,000 hours, these solid capacitors provide the stability, reliability and longevity essential to meet the meet the power needs of high-end processors and other components running today’s most demanding applications and games.


GIGABYTE Ultra Durable 3™ Classic motherboards also feature an the patented GIGABYTE DualBIOS™ technology, which features two physical BIOS ROMS mounted onto the motherboard. One chip acts as a “Main” BIOS, or the BIOS the system primarily uses during boot up. The second chip acts as a “Backup” BIOS and has the factory default BIOS version on it. If the “Main" BIOS happens to fail or stops functioning, the “Backup" will automatically take over on the next system boot with little or no down time. In fact, Dual BIOS™ often solves problematic BIOS issues before users even know they have a problem.

AMD® AM3/AM2+ 45nm Processor Support

GIGABYTE has equipped Ultra Durable 3™ Classic on the latest GIGABYTE AMD chipset-based solutions including the AMD 790GX, 790X, 780G and 770 (see a complete list of motherboards here:

GIGABYTE Ultra Durable 3™ Classic motherboards also deliver an easy upgrade path for users wanting to take advantage of AMD’s latest 45nm process technology enhancements including higher core clocks with greater energy efficiency over past generations, integrated DDR2/DDR3 memory controller (DDR3 memory support for AM3 processors and AM3 designed motherboards only), HyperTransport 3.0 and C1E enhanced power savings.
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